GEOLiNK

3.5-inch SBC / 146 × 102 mm

RP7003AW

A 3.5-inch board built around one fast storage lane: M.2 PCIe 5.0 ×4, six COM, two CAN and DC 9–36 V.

Full specification

Machine vision, kiosks and panel PCs that need storage speed plus serial reach.

RP7003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm
Specimen / RP7003AW · 146 × 102 mm
146 mm 102 mm
  • Board envelope 146 × 102 mm
  • Operating range −20 °C to +60 °C
  • DC input 9–36 V, 120 W
  • LAN / serial 2 LAN · 6 COM · 2 CAN

Board survey / four views

Component side, I/O edge, detail and assembly views.

RP7003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, front view
01 / Front Component side and mounting holes.
RP7003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, I/O edge
02 / I/O edge Rear edge: LAN, display and USB.
RP7003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, board detail
03 / Detail Header spacing around COM, CAN and GPIO.
RP7003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, heatsink view
04 / Assembly Heatsink and fan clearance for cabinet builds.

Specification / RP7003AW

Every rated number in one place.

RP7003AW specification card · revision R100
CPU platformIntel Core 12th/13th Gen-U/-P; EFI BIOS
Memory2 × DDR5 SO-DIMM; 64 GB (12th Gen) / 96 GB (13th Gen)
Storage1 × M.2 2280 PCIe 5.0 ×4; 1 × SATA 3.0
DisplayDP 1.4, HDMI 2.0, 2 × Type-C; optional LVDS/eDP
LAN2 × Intel i226-V
USB / audio2 × USB 3.0; Type-C with DP + 40 Gbps; audio jack
Serial / CANCOM1/2 RS232/485; COM3–6 RS232; 2 × CAN
ExpansionE-Key Wi-Fi/BT; B-Key 4G/5G or SSD; 8-bit GPIO
PowerDC 9–36 V, 120 W
Dimensions146 × 102 mm; 120 g without heatsink
Temperature−20 °C to +60 °C; 5–90% RH non-condensing
Operating systemWindows 10, Windows 11, Linux
RP7003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, interface side
Interface side. Connector count follows the specification card.

Interface drawing / storage lane

The M.2 slot, pulled out of the board.

The storage lane lifted off the 146 × 102 mm outline, with the serial edge below.

RP7003AW exploded interface drawing Board outline 146 by 102 millimetres with the M.2 2280 PCIe 5.0 x4 slot lifted above it, plus COM, CAN, LAN and dimension callouts. M.2 2280 · PCIe 5.0 ×4 storage lane 6 × COM 2 × CAN 2 × i226-V DP · HDMI · Type-C 146 mm 102 mm
Exploded schematic. Values from the specification card.Not a mechanical drawing.
Industrial automation cell with machine vision cameras and a control cabinet
Illustrative scene · machine vision and automation
Self-service kiosk terminal in a public service area
Illustrative scene · kiosk terminal

Applications / where the I/O lands

Machine vision, kiosks, panel PCs.

  • Machine vision and automation. 2 × Intel i226-V carry camera and cell traffic; 2 × CAN link drives and motion controllers.
  • Self-service kiosks. COM1/2 switch between RS232 and RS485 in BIOS for scanners, bill validators and scales.
  • Industrial panel PCs. DP 1.4, HDMI 2.0 and optional LVDS/eDP cover the common panel interfaces; Type-C adds a second display path.

Configuration / standard and order-time

Fixed ratings, documented choices.

Standard configurationOrder-time option
12th/13th Gen-U/-P, EFI BIOSSpecific -U/-P SKU selected at order
No LVDS/eDP fitted1 × LVDS or eDP
TPM not fittedExternal TPM 2.0
B-Key slot for 4G/5G or SSDModule matched to the deployment
DC 9–36 V, 120 W; −20 °C to +60 °CUnchanged unless a documented option says otherwise
RP7003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, option detail
Option detail. Power and temperature stay as rated.

Adjacent models / same shelf

UT1003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm

3.5-inchCore Ultra

UT1003AW

Same 146 × 102 mm envelope when 96 GB memory and AMT matter.

Open UT1003AW
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm

3.5-inch6 COM

MSK-TL5003AW

Another 3.5-inch board with a different serial and expansion mix.

Open MSK-TL5003AW
AD600Z3AW industrial motherboard, 3.5-inch Wide, 155 × 117 mm

3.5-inch Wide155 × 117 mm

AD600Z3AW

3.5-inch Wide when the enclosure allows a 155 × 117 mm board.

Open AD600Z3AW
Illustrative production line scene

RP7003AW / configuration request

Send the enclosure; get the exact configuration.

Quote within 24–48 h. Include the CPU SKU, LVDS or eDP, TPM and B-Key module; the datasheet and board-level compliance documents follow on request.

Illustrative scene image.