GEOLiNK

3.5-inch SBC / fanless controller

MSK-TL5003AW

9–36 V

DC input / 90 W · fanless

A 146 × 102 mm controller with 2 × Intel 2.5G LAN, 5 COM headers and CAN. The wide rail and the header count are the first two reasons to shortlist it.

Full specification

9 V12 V19 V24 V36 V

MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm
Fanless / 120 g without heatsink
146 × 102 mm
  • 146 × 102 mm Board envelope
  • −20 °C to +60 °C Operating range
  • DC 9–36 V / 90 W Power input
  • 2 LAN · 5 COM · 1 CAN Network / serial

Board survey / eight frames

All eight product images on file, arranged as a contact sheet. The first frame carries the board face; the rest show the solder side, heatsink profile and angled assembly.

MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, board face 01
Front / board face
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, reverse side 02
Reverse / solder side
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, heatsink profile 03
Heatsink / profile
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, angled assembly 04
Assembly / angled
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, connector row 05
Front / connector row
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, heatsink assembly 06
Assembly / heatsink
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, front view 07
Front / flat
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, plan view 08
Plan / heat spreader

Specification / MSK-TL5003AW

From Tiger Lake-U to the 36 V rail.

MSK-TL5003AW specification card, version R101
CPU platformOnboard Intel 11th Gen Tiger Lake-U, EFI BIOS; optional Celeron 6305 / i3-1115G4 / i5-1135G7 / i7-1165G7
MemoryOnboard memory chips up to 16 GB; 1 × DDR4 SO-DIMM up to 48 GB
Storage1 × M.2 M-Key 2280, NVMe PCIe 3.0 ×4 default or SATA 3.0 option; 1 × SATA 3.0
DisplayHD 2.0 up to 4096 × 2160 @ 60 Hz; eDP
LAN2 × Intel 2.5G; WiFi, 4G/5G and Bluetooth expansion supported
Serial / expansion5 × COM headers, 1 × CAN header; 2 × MSKEXT; 2 groups of 4 × USB 2.0 headers; 8-bit GPIO
PowerDC 9–36 V, 90 W
Dimensions146 × 102 mm; approx. 120 g without heatsink; fanless cooling
Temperature−20 °C to +60 °C; 0–90% RH non-condensing; storage −40 °C to +85 °C
Operating systemWindows 10, Windows 11, Linux
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, connector row
Connector row. Values from the specification card.

Header map / counts from the card

Five serial, one CAN, two MSKEXT.

Bar length follows header count. The map is about how many headers the board exposes, not where each one sits.

MSK-TL5003AW header count map Horizontal bars showing five COM headers, one CAN header, two MSKEXT interfaces, two groups of four USB 2.0 headers, one 8-bit GPIO header and one 4-pin system fan header. COM 5 headers CAN 1 header MSKEXT 2 interfaces USB 2.0 2 groups of 4 headers GPIO 8-bit header SYS FAN 1 × 4-pin
Header count map. Values from the MSK-TL5003AW specification card.Positions are not to scale.
Automation cell with a machine controller cabinet
Illustrative scene · factory automation

Applications / machine cells

LAN ports and serial links.

The header count fits a machine cell that keeps its PLCs, drives and sensors on local serial links while the two 2.5G ports carry cell traffic and maintenance traffic separately.

  • Factory robot control5 COM headers and CAN for drives, grippers and cell devices.
  • Logistics equipment controlTwo Intel 2.5G LAN ports for camera or scanner traffic and the plant network.
  • Compact machine controllersFanless build, 146 × 102 mm envelope, DC 9–36 V from a machine rail.

Configuration / three columns

CPU, memory, expansion.

ProcessorMemoryExpansion / security
Celeron 6305Onboard 8 GB2 × MSKEXT
i3-1115G4Onboard 16 GB5 COM + 1 CAN
i5-1135G71 × DDR4 SO-DIMM up to 48 GBTPM 2.0 optional
i7-1165G7Onboard plus SO-DIMMGPIO and SYS FAN headers
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, heatsink assembly
Assembly view. Power and temperature stay as rated unless a documented option says otherwise.

Adjacent models / 3.5-inch shelf

RP7003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm

3.5-inchDocumented

RP7003AW

Same envelope; compare its documented serial and display mix before choosing.

Open RP7003AW
UT1003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm

3.5-inchDocumented

UT1003AW

A second documented 3.5-inch route when the header count differs.

Open UT1003AW
AD743AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm

3.5-inchDatasheet on request

AD743AW

The same envelope with a shorter public file: images and datasheet request only.

Open AD743AW
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, plan view

MSK-TL5003AW / configuration review

Send the rail and the header list.

Quote within 24–48 h. Include CPU SKU, memory size, COM mode and the rail; the datasheet and board-level compliance documents follow on request.