AD600Z3AW
12th/13th Gen U/P at 28 W, DDR5 up to 64 GB, M.2 B/E-Key, LVDS/eDP.
Form factor / 3.5-inch Wide
The extended 3.5-inch floor plan: 9 mm more width for a second row of edge I/O, with two models and two spec cards.
Envelope check / four numbers
9 mm wider than standard 3.5-inch.
Both models.
Both models.
Dual LAN with AMT; LVDS/eDP.
Model table / 155 × 117 mm
Both carry six COM headers, CAN and 9–36 V. The platform and the LAN controllers differ.
| Model | CPU platform | LAN | COM | Power | Temperature | Documentation |
|---|---|---|---|---|---|---|
| AD600Z3AW | 12th/13th Gen U/P, 28 W | 2 × (i219LM + i226V) | 6 | 9–36 V | −20…+60 °C | Spec card on file |
| TL500Z3AW | Tiger Lake-U | 2 × (I225V + I219) | 6 | 9–36 V 90 W | −20…+60 °C | Spec card on file |
Both models support AMT and LVDS/eDP. AD600Z3AW adds LPT, PS/2 and SPDIF headers.
Shortlist / two-column choice
12th/13th Gen U/P at 28 W, DDR5 up to 64 GB, M.2 B/E-Key, LVDS/eDP.
Tiger Lake-U, onboard DDR4 plus one slot, 6 COM, 9–36 V at 90 W.
Trade-off / 155 × 117 mm
The extra width carries a second row of edge I/O: 6 COM, CAN, dual LAN with AMT, and LVDS/eDP on both models.
Standard 3.5-inch at 146 × 102 mm is smaller but loses that row. Mini-ITX at 170 × 170 mm adds PCIe and a larger board.
True-scale cutaway / 0.5 px/mm
The dashed outline is the standard 3.5-inch board. The solid outline is the Wide envelope.
Board detail / seven views







Documents / two cards
Neighbouring envelopes
FAQ / envelope decisions
No. 3.5-inch is a size class, not a mounting standard. Standard boards are 146 × 102 mm; this Wide envelope is 155 × 117 mm. Check hole positions and I/O cut-outs on the drawing.
When you need a PCIe x16 slot or a socketed 65 W CPU. Mini-ITX at 170 × 170 mm adds those; the cost is board volume and power.
Both: AD600Z3AW and TL500Z3AW. Ask for the card that matches your enclosure and I/O list.
Next step / model shortlist
Quote within 24–48 h. Datasheets on request.