GEOLiNK

Manufacturing partner / Piesia

One line, six stages, clearly labelled.

SMT, assembly, functional test, burn-in, OQC and packaging at the Piesia production base in Shenzhen. Every scene image on this page is illustrative and marked as such.

  • 8,000 m² production base
  • ~30,000 units per month
  • 40+ R&D staff
See the six frames

Manufacturing is by Shenzhen Piesia Electronic Technology Co., Ltd. No GEOLiNK facility is claimed, and the scene images are not photographs of the Piesia line.

Illustrative scene: SMT line at the manufacturing partner
Illustrative scene Not a photograph of the Piesia line

The six stages / one pass

What happens on the line.

Six stages, named in the order a board meets them. Each one is a gate, not a department.

  1. SMT

    Placement and reflow.

  2. Assembly

    Connectors and heatsink.

  3. Functional test

    Boot and I/O paths.

  4. Burn-in

    Powered soak.

  5. OQC

    Outgoing quality check.

  6. Packaging

    Carton and label.

Process frames / illustrative

Six equal frames.

Each frame carries the same label. The order is the evidence; the images are illustrations, not a facility record.

Illustrative scene: SMT placement at the manufacturing partner
01 SMT · illustrative
Illustrative scene: board assembly at the manufacturing partner
02 Assembly · illustrative
Illustrative scene: functional test bench at the manufacturing partner
03 Functional test · illustrative
Illustrative scene: burn-in racks at the manufacturing partner
04 Burn-in · illustrative
Illustrative scene: outgoing quality check at the manufacturing partner
05 OQC · illustrative
Illustrative scene: packaging station at the manufacturing partner
06 Packaging · illustrative

Material flow / one direction

The line runs in one direction.

Rejected units leave the main flow; released boards continue forward. The flow is the process claim, not the photographs.

Each gate closes on a record: paste inspection after SMT, a boot and I/O pass at functional test, a powered soak at burn-in, an outgoing sample at OQC. Packaging is released only after OQC.

Six-stage production flow A forward line from SMT to packaging with six numbered gates and a separate rework branch. 01 02 03 04 05 06 SMT Assembly Test Burn-in OQC Packaging REWORK / SCRAP
Illustrative process diagram · six gates, one forward path

Scale / what comes off the line

The base and the boards.

Scale figures describe the Piesia production base. The boards below are documented models that run through this line.

8,000 m²Production base
~30,000Units per month
40+R&D staff
6Production stages
TOP800B industrial motherboard, Mini-ITX, 170 × 170 mm, front view TOP800B Mini-ITX · 170 × 170 mm AD600CA industrial motherboard, NUC, 100 × 100 mm, front view AD600CA NUC · 100 × 100 mm PNM-5210 industrial motherboard, NANO-ITX, 120 × 120 mm, front view PNM-5210 NANO-ITX · 120 × 120 mm
Illustrative scene: production line overview at the manufacturing partner
Illustrative scene · line overview

Image disclosure / read with the frames

What these images are.

These images are illustrative scenes. They are not photographs of a GEOLiNK facility and not photographs of the Piesia line. They show equipment type and sequence, nothing more.

  • Manufacturing partnerPiesia
  • GEOLiNK facilityNone claimed
  • Scene statusIllustrative
  • Piesia line photographNot claimed
Illustrative scene: production line aisle at the manufacturing partner
Illustrative scene · not a photograph of the Piesia line
Illustrative scene: electronics production line Illustrative scene

Factory question / scoped inquiry

Ask about the line, not a tour brochure.

Send the model, the process evidence you need and the quantity. Quote within 24–48 h; audit and access terms are confirmed per project.

Manufacturing is by Piesia. Scene images are illustrative; no real-photo claim is made.