Capabilities / GEOLiNK + Piesia

Five capabilities. One path from change request to production.

BIOS, I/O, thermal, packaging and documentation. A sample first, production after validation.

GEOLiNK is the brand and supply partner. Manufacturing is by Shenzhen Piesia Electronic Technology Co., Ltd.

Open the five capabilities
Illustrative scene: board assembly at the manufacturing partner's production base
Illustrative scene · manufacturing by Piesia
TOP800B industrial motherboard, Mini-ITX, 170 × 170 mm, front view
TOP800B · a customization base
ITX660B industrial motherboard, Mini-ITX, 170 × 170 mm, front view
ITX660B · engineering review base

The capability index / five entries

What can change, and who owns it.

Each entry links to the page that proves it.

01
TOP800B industrial motherboard, Mini-ITX, 170 × 170 mm, I/O edge

OEM & ODM

BIOS and boot logo, I/O pinout and protection, heatsink, packaging and silkscreen. The change is scoped before a sample is built.

Change surface
02
ITX660B industrial motherboard, Mini-ITX, 170 × 170 mm, rear I/O strip

Engineering & DFM

Enclosure fit, thermal path, connector clash and DFM before tooling. The review happens before tooling, not after.

Review surface
03
Illustrative Illustrative scene: SMT line at the manufacturing partner's production base

Manufacturing & test

SMT, assembly, burn-in and test, carried out at Piesia. Test coverage is confirmed per project.

Build surface
04
CE-EMC document for the Q-BOX-S5 industrial mini PC, held by Piesia

Quality & compliance

Board-level documents on request. Q-BOX-S5 documents are held by Piesia. The scope stays with the document holder.

Document surface
05
Illustrative Illustrative scene: packaging station at the manufacturing partner's production base

Lifecycle & supply

Revision notice, change records and embedded availability where documented. Open terms are confirmed at quotation.

Supply surface

Certificate image: Q-BOX-S5 Industrial Mini PC, document held by Piesia. It does not represent certification of a bare board.

Sample to production / six steps

The path is the same for every change.

A change request enters at step one. Each step has an owner and a record; production starts only after validation.

Six-step sample-to-production path Requirement, engineering review, sample, validation, pilot and production, connected left to right. 01 Requirement scope + change list 02 Engineering review DFM + thermal 03 Sample first article 04 Validation fit + function 05 Pilot small run 06 Production repeat run
Six steps, left to right. Sample terms, MOQ and lead time are confirmed at quotation.

Scroll for all six steps.

Piesia scale / supplier evidence

The line behind the sample.

8,000 m² Production base.
~30,000 Units per month.
40+ R&D staff.
25 English specification cards.
6 Form factors.

Piesia scale from supplier documentation. The numbers describe the partner, not a capacity guarantee for a given project. Customization scope is confirmed per project; MOQ and lead time are open items.

Change matrix / routine or tooling

What is routine, what needs tooling.

Routine changes move fastest; tooling changes set the sample date.

Change Class What it needs MOQ impact
BIOS and boot logo Routine Software build and release check Open
I/O pinout and protection Review Schematic and EMC review Open
Heatsink and enclosure Tooling Thermal review and new tooling Tooling-dependent
Packaging and silkscreen Print setup Artwork proof and print plates Open
Any change request Open Scope confirmed at quotation Confirmed with your quote

Brand and manufacturer

Two names, stated plainly.

GEOLiNK is the brand and supply partner. Manufacturing is by Shenzhen Piesia Electronic Technology Co., Ltd. No own-factory claim is made.

Brand-use and authorization wording are confirmed with your quote. The engineering, sample and production record follows the project, not the logo.

Illustrative scene: the manufacturing partner's production building
Illustrative scene · manufacturing by Piesia
Illustrative scene: outgoing quality check at the manufacturing partner
Illustrative · outgoing check
Illustrative scene: burn-in racks at the manufacturing partner
Illustrative · burn-in

Deliverables / request per project

What you can ask to see.

Deliverable When Format
Model datasheet At quotation PDF
Board-level documents On request PDF
Revision and change notice With production release PDF
Test records Where the supplier holds them PDF

Documents follow the model, not the website. Ask for the set that matches the board and the customization scope. Tell us which set you need before the quote.

Q-BOX-S5 Industrial Mini PC, document held by Piesia. The certificate scope is the mini PC, not the bare board.

Six envelopes / one supply path

Where a project can start.

The catalog spans six form factors. The envelope usually decides the first conversation.

PNM-5210 industrial motherboard, NANO-ITX, 120 × 120 mm
NANO-ITX120 × 120 mm · PNM-5210
AD600Z3AW industrial motherboard, 3.5-inch Wide, 155 × 117 mm
3.5-inch Wide155 × 117 mm · AD600Z3AW
RP7003AW industrial motherboard, 3.5-inch, 146 × 102 mm
3.5-inch146 × 102 mm · RP7003AW
UT1003AW industrial motherboard, 3.5-inch, 146 × 102 mm
3.5-inch146 × 102 mm · UT1003AW
TOP800B industrial motherboard, Mini-ITX, 170 × 170 mm
Mini-ITX170 × 170 mm · TOP800B
ITX660B industrial motherboard, Mini-ITX, 170 × 170 mm
Mini-ITX170 × 170 mm · ITX660B

Project inquiry / scoped

Send the change list, not a blank request.

Tell us the model, the enclosure and the changes you need. Include the target date and the enclosure drawing. Quote within 24–48 h.

Open terms, MOQ, sample timing and lead time, are confirmed at quotation.

Illustrative scene: an electronics production line Illustrative scene