TMIA70B industrial motherboard, Mini-ITX, 170 × 170 mm
Specimen / TMIA70B · 170 × 170 mm
AMD Phoenix

Mini-ITX / AMD Ryzen Phoenix

TMIA70B

Ryzen 5/7 Phoenix at 45 W, DDR5 up to 96 GB and an LVDS path at 1920 × 1200 / 120 Hz. TPM 2.0 is built in.

Full specification

Board cutout on file; 170 × 170 mm envelope.

Platform strip / same envelope

AMD or Intel, 170 × 170 mm.

Three Mini-ITX routes, one envelope. Platform and memory are the first split.

TMIA70B industrial motherboard, Mini-ITX, 170 × 170 mm, top face

TMIA70B

AMD Ryzen Phoenix

  • CPURyzen 5/7, 45 W
  • MemoryDDR5, 96 GB
  • Range−20 to +60 °C
TIM800B industrial motherboard, Mini-ITX, 170 × 170 mm

TIM800B

Intel Core Ultra

  • CPUCore Ultra, 125H–255H
  • MemoryDDR5, 96 GB
  • Range−10 to +60 °C
TIM600B industrial motherboard, Mini-ITX, 170 × 170 mm

TIM600B

Intel Alder Lake

  • CPUAlder Lake, 45 W
  • MemoryDDR4, 64 GB
  • Range−20 to +60 °C
  • 170 × 170 mm Board envelope
  • −20 °C to +60 °C Operating range
  • DC 12–19 V + ATX 4-pin Power input
  • 1 LAN · 1 DB9 · 120 Hz Network / display

Specification / TMIA70B

Ryzen Phoenix, card by card.

TMIA70B specification, revision R110
CPU platformAMD Ryzen 5/7 Phoenix, 45 W; optional 7640HS / 8845HS
Memory2 × DDR5-5600 SO-DIMM; 96 GB max
Storage1 × M.2 Key-M 2280 NVMe; 1 × SATA
DisplayHDMI 2.0 at 4K / 60 Hz; LVDS 1920 × 1200 / 120 Hz; VGA optional
LAN1 × RTL8111H
Serial / expansion1 × DB9; 4 × USB 3.2; DP side-out not populated; M.2 E-Key; USB headers
PowerDC 12–19 V + ATX 4-pin; rated 12 V
Dimensions170 × 170 mm; 150 g without heatsink
Temperature−20 °C to +60 °C; 5–90% RH; storage −40 °C to +85 °C
Operating systemWindows 10, Windows 11, Linux
TMIA70B industrial motherboard, Mini-ITX, 170 × 170 mm, top with headers
Header side. Values from the specification card.

Interface map / edge and headers

One LAN, one DB9, one panel path.

The map separates the edge I/O from the onboard headers.

TMIA70B interface map Edge group with HDMI 2.0 at 4K 60 hertz, four USB 3.2 ports, one RTL8111H LAN, one DB9 serial port and audio. Header group with LVDS at 1920 by 1200 and 120 hertz, M.2 E-Key, TPM 2.0 and USB headers. EDGE I/O HDMI 2.0 USB 3.2 ×4 LAN DB9 Audio 4K @ 60 Hz RTL8111H ONBOARD HEADERS LVDS TPM 2.0 M.2 E-Key USB headers 1920 × 1200 @ 120 Hz built in / external optional USB 3.0 + USB 2.0
Interface map. Values from the TMIA70B specification card.Not a connector-position drawing.

Applications / AMD edge builds

Control, vision, terminals.

Ryzen Phoenix and 96 GB DDR5 suit an edge build that keeps vision or terminal software local. One DB9 and one LAN keep the machine link simple.

  • Industrial controlOne DB9 link and built-in TPM 2.0.
  • Machine visionRyzen Phoenix, 96 GB DDR5 and M.2 NVMe.
  • Self-service terminalsHDMI 2.0 plus LVDS at 120 Hz.
Automation cell with an edge computing cabinet
Illustrative scene · factory automation

Configuration / standard and optional

SKU, VGA, TPM.

ItemStandardOptional
ProcessorRyzen 5/7 Phoenix, 45 W7640HS or 8845HS
VGANot populatedVGA output
TPMTPM 2.0 built inExternal TPM 2.0
PowerDC 12–19 V + ATX 4-pinStays as rated
TMIA70B industrial motherboard, Mini-ITX, 170 × 170 mm, reverse-side detail
Reverse-side detail. Power and temperature stay as rated unless a documented option says otherwise.

TMIA70B / platform and panel review

Send the AMD requirement.

Quote within 24–48 h. Include the Ryzen SKU, memory, panel resolution and power rail; the datasheet and compliance documents follow on request.

TMIA70B industrial motherboard, Mini-ITX, 170 × 170 mm, reverse side